JPH0727637Y2 - 浸漬冷却構造 - Google Patents

浸漬冷却構造

Info

Publication number
JPH0727637Y2
JPH0727637Y2 JP1989147032U JP14703289U JPH0727637Y2 JP H0727637 Y2 JPH0727637 Y2 JP H0727637Y2 JP 1989147032 U JP1989147032 U JP 1989147032U JP 14703289 U JP14703289 U JP 14703289U JP H0727637 Y2 JPH0727637 Y2 JP H0727637Y2
Authority
JP
Japan
Prior art keywords
cooling
heat
substrate
cooling plate
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989147032U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0387177U (en]
Inventor
伸嘉 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989147032U priority Critical patent/JPH0727637Y2/ja
Publication of JPH0387177U publication Critical patent/JPH0387177U/ja
Application granted granted Critical
Publication of JPH0727637Y2 publication Critical patent/JPH0727637Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP1989147032U 1989-12-22 1989-12-22 浸漬冷却構造 Expired - Lifetime JPH0727637Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147032U JPH0727637Y2 (ja) 1989-12-22 1989-12-22 浸漬冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147032U JPH0727637Y2 (ja) 1989-12-22 1989-12-22 浸漬冷却構造

Publications (2)

Publication Number Publication Date
JPH0387177U JPH0387177U (en]) 1991-09-04
JPH0727637Y2 true JPH0727637Y2 (ja) 1995-06-21

Family

ID=31693565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147032U Expired - Lifetime JPH0727637Y2 (ja) 1989-12-22 1989-12-22 浸漬冷却構造

Country Status (1)

Country Link
JP (1) JPH0727637Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771500B1 (en) * 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
US20090260783A1 (en) * 2006-03-06 2009-10-22 Tokyo University Of Science Educational Foundation Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56103453A (en) * 1980-01-21 1981-08-18 Hitachi Ltd Lsi apparatus system
JPS57103338A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Boiling cooling device

Also Published As

Publication number Publication date
JPH0387177U (en]) 1991-09-04

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